This is a micro-focused X-ray inspection equipment, mainly used for the inspection of BGA/CSP, inserted components, SOP/QFP, transistors, CHIP components, bottom electrode components, QFN, power modules, and the inspection of missing solder joints, non-wetting, solder quantity, offset, foreign matter, bridging, the presence or absence of pins, etc. (different options are made according to the inspection object). The inspection software independently developed by VJ can perform image processing, analysis, and automatic defect calculation on various electronic components.